Events

Upcoming Events 

Dec 1, 2023 - Apr 29, 2024

ASAP Fall IAB Meeting

 

Past Events

Mar 6, 2021 - Dec 1, 2023

Webinar: Theme 2 - Heterogeneous 3D Integration
Industry Planning Workshop

Industry Planning Workshop

1000 Holonyak Micro & Nanotechnology Building

Pre-industry Advisory Board (IAB) Meeting
Spring 2023 Industry Workshop & Advisory Board Meeting

Spring 2023 Industry Workshop & Advisory Board Meeting

Electrical and Computer Engineering Building, Room 3002

Webinar: Fall Semester Kick Off Webinar

Webinar: Fall Semester Kick Off Webinar

Shaloo Rakheja - ASAP Center Director

Fall 2023 Industry Workshop & Advisory Board Meeting

December 5-6, 2023
Virtual Meeting
Zoom Link will be sent to registered email address prior to the event.

How can universities, industry and national labs work together to create the next-generation of energy-efficient, high-performance semiconductors? Learn how we can partner to meet the U.S.’s CHIPS Act goals at the University of Illinois Urbana-Champaign. 

Join us as we discuss cutting-edge semiconductors and microelectronics research at Illinois and engage with students at the 5 minute poster session. You will also meet top semiconductor industry, national lab, and DoD members. Registration is free.

Register

Contact

Please contact Shaloo Rakheja (rakheja@illinois.edu) or Mallory Gorman (magorma2@illinois.edu) for more information.

Accessing the Meeting

After registering here, a Zoom link and meeting invite will be sent to your registered email address. Please reach out to the above contacts if you have not received the invite by Monday, December 4th. 

Agenda

Day 1 December 5, 2023
10:00-10:30 AM

Welcome Remarks

Melanie Loots, Executive Associate Vice Chancellor for Research & Innovation 
Harley Johnson, Associate Dean for Research
Laurel Passantino, Assistant Dean for Research, GCOE

10:30-11:15 AM

ASAP Center Updates

Shaloo Rakheja, Director of ASAP Center
Qing Cao, Associate Director of ASAP Center

11:15-12:45 PM

Project Presentations

John Abelson, Gregory GirolamiTopological Semimetals by Superconformal CVD 
Lynford Goddard, Kent Choquette, Paul BraunoPhotonic Interface for Smart Packaging 
Wenjuan Zhu, Shaloo Rakheja, Transforming Future Computing Using Ferroelectric Devices

12:45-1:30 PM BREAK
1:30-3:00 PM

Project Presentations

Arend van der ZandeStrain-Induced Mobility Enhancement in 2D Material Transistor 
Qing Cao, Transfer-Printed Signle-Crystalline Si Nanomembrane for High-Performance Junctionless MOSFET on BEOL
Saugata Ghose, Shaloo RakhejaExploring Novel Memory Architecture Using Emerging Devices

3:00-3:30 PM

Q&A Session 
Town-hall format, with ASAP Leadership Team, NSF, and Industry Advisory Board 

 

Day 2 December 6, 2023
10:00-10:30 AM

Keynote Speaker Presentation
Critical Nano-Metrology for Emerging Technologies

Jiong Zhang, Intel                                              

10:30-11:00 AM

Education and Workforce Development

Shaloo Rakheja, ASAP Center Director

11:00-11:30 AM 5 Minute Student Poster Presentations
11:30-11:45 AM

Potential New Project Overview

Naresh Shanbhag
William P. King

11:45-12:00 PM PI Response to Industry Feedback
12:00-1:00 PM

BREAK
The remaining sessions are closed to the public and are restricted to only IAB Members and NSF.

1:00-2:00 PM

Closed IAB Meeting
IAB Members and NSF Only

2:00-2:30 PM

Discussions of Closed IAB Meeting with ASAP Leadership
IAB Members and NSF Only

Keynote Details - 

Critical Nano-Metrology for Emerging Technologies

Dr. Jiong Zhang - Principal Engineer at Intel

Bio: Jiong Zhang received his PhD from the University of Illinois at Urbana Champaign, and his MA and BA both from Tsinghua University, all in Materials Science and Engineering. Jiong joined Intel in 2011, and is currently a Principal Engineer focusing on Silicon technology R&D, advanced analytical technique development and competitive analysis across industry. Jiong has also led multiple research projects with universities and national labs for emerging nanoelectronics metrology innovations. Jiong has more than 40 scientific journals publications and several invited book chapters.

Abstract: Metrology is an essential and integrated part for Si technology development, manufacturing and yield. Transistor scaling with introduction of novel architectures and new materials have raised considerable challenges for metrology at nanoscale. This keynote will focus on advanced and state of art analytical techniques from device to array to wafer level, to address the metrology gaps for continuing Moore’s Law, to build the next stage metrology for structural, compositional and property characterization.