Addressing energy and performance challenges of data communication from microscale to macroscale
University of Illinois Urbana-Champaign
Fall IAB Meeting - December 5 & 6, 2023
The Center for Advanced Semiconductor Chips with Accelerated Performance (ASAP) is working to strengthen U.S. leadership in critical technologies — including high-performance computing, advanced manufacturing, 5G and beyond — by creating new materials and process paradigms for efficient electrical interconnects, photonic integration, and in-memory computing solutions targeting digital, analog, and RF platforms.
ASAP’s research program includes:
- multiphysics modeling of inverse material design and reliability-aware materials process development for improved interconnect conductors and inter-wire dielectrics;
- scalable integration of III-V and III-N devices on silicon for optical and terahertz interconnects;
- development of non- volatile CMOS-compatible memory for in-memory and non-von Neumann computing.
ASAP will also strive to advance the new frontier of low temperature, ultra-high aspect ratio, in situ and 3D monitoring, and self- assembled monolithic approaches. The tightly coupled experimental-theoretical approach to materials design, the cross- disciplinary expertise of team members, and experimental capabilities are required to address challenging scientific and industry-relevant problems.
The project was supported by the Center for Advanced Semiconductor Chips with Accelerated Performance (ASAP), an IUCRC supported by NSF under Grant #EEC-2231625.
Shaloo Rakheja, Naresh Shanbhag, and Qing Cao discuss how the ASAP Center and its collaborators are meeting the challenges facing the semiconductor industry.
ASAP Member Organizations
- Advanced Micro Devices, Inc. (AMD)
- Intel Corporation
- LG Innotek Co., Ltd.
- Massachusetts Institute of Technology Lincoln Lab (MIT LL)
- Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
- Raytheon Technologies