Addressing energy and performance challenges of data communication from microscale to macroscale
University of Illinois Urbana-Champaign
Spring IAB Meeting - April 18 & 19, 2024
Find more information HERE
The Center for Advanced Semiconductor Chips with Accelerated Performance (ASAP) is working to strengthen U.S. leadership in critical technologies — including high-performance computing, advanced manufacturing, 5G and beyond — by creating new materials and process paradigms for efficient electrical interconnects, photonic integration, and in-memory computing solutions targeting digital, analog, and RF platforms.
ASAP’s research program includes:
- multiphysics modeling of inverse material design and reliability-aware materials process development for improved interconnect conductors and inter-wire dielectrics;
- scalable integration of III-V and III-N devices on silicon for optical and terahertz interconnects;
- development of non- volatile CMOS-compatible memory for in-memory and non-von Neumann computing.
ASAP will also strive to advance the new frontier of low temperature, ultra-high aspect ratio, in situ and 3D monitoring, and self- assembled monolithic approaches. The tightly coupled experimental-theoretical approach to materials design, the cross- disciplinary expertise of team members, and experimental capabilities are required to address challenging scientific and industry-relevant problems.
Shaloo Rakheja, Naresh Shanbhag, and Qing Cao discuss how the ASAP Center and its collaborators are meeting the challenges facing the semiconductor industry.
The project was supported by the Center for Advanced Semiconductor Chips with Accelerated Performance (ASAP), an IUCRC supported by NSF under Grant #EEC-2231625.
ASAP Member Organizations
- Advanced Micro Devices, Inc. (AMD)
- Intel Corporation
- LG Innotek Co., Ltd.
- Massachusetts Institute of Technology Lincoln Lab (MIT LL)
- Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
- Raytheon Technologies